Light-emitting diode chip package body and packaging method thereof

ABSTRACT

AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.

RELATED APPLICATIONS

This application is a Divisional patent application of co-pendingapplication Ser. No. 11/004,910, filed on 7 Dec. 2004.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a light-emitting diode chip, andespecially to a light-emitting diode chip package body and a packagingmethod of the light-emitting diode chip package body.

2. Description of the Related

In general, the LED (Light-emitting diode) of prior art comprises apackage substrate and/or an electric conduction frame and an LED chipdisposed on the package substrate and/or the electric conduction frame.The LED chip has a plurality of pads electrically connected tocorresponding joining points of the package substrate and/or theelectric conduction through corresponding metal wires by wire bondingprocess. However, the packaging process according to the above packagingmethod wastes time. Thus, the output and the quality of the LED chippackage body will not improve.

Furthermore, the size of the LED is increasingly small with theadvancement of the chip process and the area of the pad of the LED chipis increasingly small. Thus, it is hard to carry out the wire bondingprocess on the small area of the pad.

With the employment of unique considerations and application oftheories, and based on several years experience in specializedproduction of all flexible assembly systems and mechanisms, the inventorhas come up with an innovative light-emitting diode chip package body.

SUMMARY OF THE INVENTION

The primary object of the present invention is to provide alight-emitting diode chip package body and a packaging method of thelight-emitting diode chip package body. The light-emitting diode chippackage body and the packaging method of the light-emitting diode chippackage body are used to resolve the problems of the pad of the LED chipof the prior art.

In order to achieve the above objects, the present invention provides alight-emitting diode chip package body comprising a light-emitting diodechip having a pad-installed surface formed thereon, a plurality of padsinstalled on the pad-installed surface and a rear surface formed on anopposite side of the pad-installed surface; a light-reflecting coatingdisposed on the pad-installed surface and having a plurality ofpad-exposed holes for exposure of the corresponding pads of thelight-emitting diode; a surface insulation layer disposed on the rearsurface of the light-emitting diode chip and having a central throughhole for exposure of a central portion of the rear surface; a firstlight-transparent element received in the central through hole of thesurface insulation layer; and a plurality of conductive projectingblocks, each of the conductive projecting blocks disposed on thecorresponding pad of the light-emitting diode.

In order to achieve the above objects, the present invention provides alight-emitting diode chip package body comprising a light-emitting diodechip having a pad-installed surface formed thereon, a plurality of padsinstalled on the pad-installed surface and a rear surface formed on anopposite side of the pad-installed surface; a light-reflecting coatingdisposed on the rear surface of the light-emitting diode chip; aninsulative protective layer formed on the light-reflecting coating; asurface insulation layer disposed on the rear surface of thelight-emitting diode chip, and having a central through hole forexposure of a central portion of the rear surface and a plurality ofpad-exposed holes for exposure of the corresponding pads; a firstlight-transparent element received in the central through hole of theinsulative protective layer; and a plurality of conductive projectingblocks, each of the conductive projecting blocks disposed on thecorresponding pad of the light-emitting diode.

In order to achieve the above objects, the present invention provides alight-emitting diode chip package body comprising an insulativesubstrate including at least one chip-installed scope, the at least onechip-installed scope having a chip-installed surface, a rear face formedopposite the chip-installed surface, a through hole penetrating throughthe chip-installed surface and the rear face and a plurality ofconductive tracks extending from the chip-installed surface to the rearface through the through hole; a substrate insulative layer disposed onthe chip-installed surface to form an open hole for exposure of acentral scope of the at least one chip-installed scope; at least onelight-emitting diode chip disposed on the at least one chip-installedscope of the insulative substrate, and having a pad-installed surfaceformed thereon, a plurality of pads installed on the pad-installedsurface and a rear surface formed on an opposite side of thepad-installed surface; a light-reflecting coating disposed on thepad-installed surface and having a plurality of pad-exposed holes forexposure of the corresponding pads of the at least one light-emittingdiode chip; a plurality of conductive projecting blocks, each of theconductive projecting blocks disposed on the corresponding pad of the atleast one light-emitting diode chip and electrically connected to thecorresponding conductive tracks; a heat-conducting layer formed betweenthe insulative substrate and the at least one light-emitting diode chip;and a light-transparent element disposed on the rear face of the atleast one light-emitting diode chip.

In order to achieve the above objects, the present invention provides alight-emitting diode chip package body comprising an insulativesubstrate including at least one chip-installed scope, the at least onechip-installed scope having a chip-installed surface, a rear face formedopposite the chip-installed surface, a through hole penetrating throughthe chip-installed surface and the rear face and a plurality ofconductive tracks extending from the chip-installed surface to the rearface through the through hole; a substrate insulative layer disposed onthe chip-installed surface to form an open hole for exposure of acentral scope of the at least one chip-installed scope; at least onelight-emitting diode chip disposed on the at least one chip-installedscope of the insulative substrate, and having a pad-installed surfaceformed thereon, a plurality of pads installed on the pad-installedsurface and a rear surface formed on an opposite side of thepad-installed surface; a heat-conducting layer formed between theinsulative substrate and the at least one light-emitting diode chip; aninsulative material layer disposed between the internal wall of each ofthe open holes and the corresponding conductive body, the insulativematerial layer being thicker near the at least one light-emitting diodechip and thinner near the substrate insulative layer, so that theinsulative material layer has a concave top face; a metal reflectinglayer formed on the insulative material layer; a transparent protectionlayer formed on the metal reflecting layer; and a plurality ofconductive projecting blocks, each of the conductive projecting blocksdisposed on the corresponding pad of the at least one light-emittingdiode chip and electrically connected to the corresponding conductivetracks.

In order to achieve the above objects, the present invention provides alight-emitting diode chip package body comprising a light-emitting diodechip having a pad-installed surface formed thereon, a plurality of padsinstalled on the pad-installed surface and a rear surface formed on anopposite side of the pad-installed surface; a light-reflecting coatingdisposed on the pad-installed surface and having a plurality ofpad-exposed holes for exposure of the corresponding pads of thelight-emitting diode; a first light-transparent element disposed on therear face of the light-emitting diode chip; and a plurality ofconductive projecting blocks, each of the conductive projecting blocksdisposed on the corresponding pad of the light-emitting diode.

In order to achieve the above objects, the present invention provides apackaging method of a light-emitting diode chip package body, thepackaging method comprising providing a light-emitting diode chip havinga pad-installed surface formed thereon, a plurality of pads installed onthe pad-installed surface and a rear surface formed on an opposite sideof the pad-installed surface; setting a light-reflecting coating on thepad-installed surface, the light-reflecting coating having a pluralityof pad-exposed holes for exposure of the corresponding pads of thelight-emitting diode; forming a surface insulation layer on the rearsurface of the light-emitting diode chip, the surface insulation layerhaving a central through hole for exposure of a central portion of therear surface; setting a first light-transparent element in the centralthrough hole of the surface insulation layer; and setting a plurality ofconductive projecting blocks, with each of the conductive projectingblocks disposed on the corresponding pad of the light-emitting diode.

In order to achieve the above objects, the present invention provides apackaging method of a light-emitting diode chip package body, thepackaging method comprising providing a light-emitting diode chip havinga pad-installed surface formed thereon, a plurality of pads installed onthe pad-installed surface and a rear surface formed on an opposite sideof the pad-installed surface; setting a light-reflecting coating on therear surface of the light-emitting diode chip; forming an insulativeprotective layer on the light-reflecting coating; forming an insulativelayer on the pad-installed surface of the light-emitting diode chip, theinsulative layer having a central through hole for exposure of a centralportion of the pad-installed surface and plurality of pad-exposed holesfor exposure of the corresponding pads; setting a firstlight-transparent element in the central through hole of the insulationlayer; and setting a plurality of conductive projecting blocks, each ofthe conductive projecting blocks being disposed on the corresponding padof the light-emitting diode.

In order to achieve the above objects, the present invention provides apackaging method of a light-emitting diode chip package body, thepackaging method comprising providing an insulative substrate includingat least one chip-installed scope, the at least one chip-installed scopehaving a chip-installed surface, a rear face formed opposite thechip-installed surface, a through hole penetrating through thechip-installed surface and the rear face and a plurality of conductivetracks extending from the chip-installed surface to the rear facethrough the through hole; setting a substrate insulative layer on thechip-installed surface to form an open hole for exposure of a centralscope of the at least one chip-installed scope; setting at least onelight-emitting diode chip on the at least one chip-installed scope ofthe insulative substrate, the at least one light-emitting diode chiphaving a pad-installed surface formed thereon, a plurality of padsinstalled on the pad-installed surface and a rear surface formed on anopposite side of the pad-installed surface; setting a light-reflectingcoating on the pad-installed surface, the light-reflecting coatinghaving a plurality of pad-exposed holes for exposure of thecorresponding pads of the at least one light-emitting diode chip;setting a plurality of conductive projecting blocks, each of theconductive projecting blocks being disposed on the corresponding pad ofthe at least one light-emitting diode chip and electrically connected tothe corresponding conductive tracks; forming a heat-conducting layerbetween the insulative substrate and the at least one light-emittingdiode chip; and setting a light-transparent element on the rear face ofthe at least one light-emitting diode chip.

In order to achieve the above objects, the present invention provides apackaging method of a light-emitting diode chip package body, thepackaging method comprising providing an insulative substrate includingat least one chip-installed scope, the at least one chip-installed scopehaving a chip-installed surface, a rear face formed opposite thechip-installed surface, a through hole penetrating through thechip-installed surface and the rear face and a plurality of conductivetracks extending from the chip-installed surface to the rear facethrough the through hole; setting a substrate insulative layer on thechip-installed surface to form an open hole for exposure of a centralscope of the at least one chip-installed scope; setting at least onelight-emitting diode chip on the at least one chip-installed scope ofthe insulative substrate, the at least one light-emitting diode chiphaving a pad-installed surface formed thereon, a plurality of padsinstalled on the pad-installed surface and a rear surface formed on anopposite side of the pad-installed surface; forming a heat-conductinglayer between the insulative substrate and the at least onelight-emitting diode chip; setting an insulative material layer betweenthe internal wall of each of the open holes and the correspondingconductive body, the insulative material layer being thicker near the atleast one light-emitting diode chip and thinner near the substrateinsulative layer, so that the insulative material layer has a concavetop face; forming a metal reflecting layer on the insulative layer;forming a transparent protection layer on the metal reflecting layer;and setting a plurality of conductive projecting blocks, each of theconductive projecting blocks being disposed on the corresponding pad ofthe at least one light-emitting diode chip and electrically connected tothe corresponding conductive tracks.

In order to achieve the above objects, the present invention provides apackaging method of a light-emitting diode chip package body, thepackaging method comprising providing a light-emitting diode chip havinga pad-installed surface formed thereon, a plurality of pads installed onthe pad-installed surface and a rear surface formed on an opposite sideof the pad-installed surface; setting a light-reflecting coating on thepad-installed surface, the light-reflecting coating having a pluralityof pad-exposed holes for exposure of the corresponding pads of thelight-emitting diode; setting a first light-transparent element on therear face of the light-emitting diode chip; and setting a plurality ofconductive projecting blocks, each of the conductive projecting blocksbeing disposed on the corresponding pad of the light-emitting diode.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, and are intended toprovide further explanation of the invention as claimed. Otheradvantages and features of the invention will be apparent from thefollowing description, drawings and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The various objects and advantages of the present invention will be morereadily understood from the following detailed description when read inconjunction with the appended drawing, in which:

FIGS. 1 to 4 are schematic, cross-sectional views of the LED chippackage body according to the steps of the first embodiment of thepresent invention;

FIG. 5 is a schematic, cross-sectional view of the LED chip package bodyaccording to the second embodiment of the present invention;

FIG. 6 is a schematic, cross-sectional view of the LED chip package bodyaccording to the third embodiment of the present invention;

FIGS. 7 to 9 are schematic, cross-sectional views of the LED chippackage body according to the steps of the fourth embodiment of thepresent invention;

FIG. 10 is a schematic, cross-sectional view of another conductiveprojecting block of the present invention;

FIG. 11 is a schematic, cross-sectional view of another conductiveprojecting block of the present invention;

FIGS. 12 to 18 are schematic, cross-sectional views of the LED chippackage body according to the steps of the fifth embodiment of thepresent invention;

FIGS. 19 to 21 are schematic, cross-sectional views of the LED chippackage body according to the steps of the sixth embodiment of thepresent invention;

FIGS. 22 to 27 are schematic, cross-sectional views of anotherconductive projecting block according to the steps of the presentinvention;

FIGS. 28 to 32 are schematic, cross-sectional views of anotherconductive projecting block according to the steps of the presentinvention; and

FIGS. 33 to 34 are schematic, cross-sectional views of the LED chippackage body according to the steps of the seventh embodiment of thepresent invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring to FIGS. 1 to 4, the first embodiment of the present inventionprovides an LED chip package and a packaging method of the LED chippackage.

Referring to FIG. 1, the steps of the first embodiment provide alight-emitting diode (LED) chip 10. The LED chip 10 is or is not cutfrom a wafer and has a pad-installed surface 100, a plurality of pads102 disposed on the pad-installed surface 100 and a rear surface 101disposed opposite the pad-installed surface 100.

The steps of the first embodiment comprise forming a light-reflectingcoating 11 on the pad-installed surface 100 with a plurality ofpad-exposed holes 110 for exposure of the corresponding pads 102.

Referring to FIG. 2, the steps of the first embodiment comprise settinga plurality of protrusions 12 on the corresponding pads 102, afterforming the light-reflecting coating 11 on the pad-installed surface100. The protrusions 12 are made of a photoresist material like apolyimide. First, photoresist material is used to form a protrusionlayer (not shown in drawing) on the light-reflecting coating 11, thenthe protrusions 12 are formed from the protrusion layer by a developmentand exposure process.

The steps of the first embodiment comprise forming a surface insulativehousing 13 on the rear surface 101 of the LED chip 10. The surfaceinsulative housing 13 is made of a photoresist material like asensitization printing ink. After forming the surface insulative housing13 on the rear surface 101, a central through hole 130 is formed forexposure of a central portion of the rear surface 101 by a developmentand exposure process.

Referring to FIG. 3, the steps of the first embodiment comprise forminga first metal layer 14 on each of the pads 102 for covering a surface ofthe corresponding pad 102 and the corresponding protrusion 12. The firstmetal layer 14 is made of any metal material like aluminum.

Then, the steps of the first embodiment comprise forming a second metallayer 15 on the first metal layer 14. Each of the protrusions 12 and thecorresponding first and second metal layers 14, 15 are formed togetherto form a conductive projecting block. Each of the second metal layers15 is composed of a nickel layer 150 and a gold layer 151.

Referring to FIG. 4, the steps of the first embodiment comprise settinga light-transparent element 16 in the central through hole 130 of thesurface insulative layer 13. The light-transparent element 16 is made ofa polyimide and has a cambered top portion. The light-transparentelement 16 has light-polarizing compound with different wavelengthsdoped therein to provide light passing through the light-transparentelement 16 with good color.

Referring to FIG. 10, the protrusion 12 is made of metal material likegold to form the conductive projecting block. When the protrusion 12 ismade of gold, the conductive projecting block is formed without usingthe first and second metal layer 14, 15. Referring to FIG. 11, the stepsof the present invention comprises forming a bonded metal layer 28 oneach of the pads 102, before using the photoresist to form theprotrusion 12. The protrusion 12 is formed by any processing method inthe present invention.

Above the LED chip package and the packaging method of the LED chippackage body have some advantages, comprising:

1. The size of the LED chip package body is similar to the LED chip, sothat the size of the LED chip package body is smaller than “0603”,“0804” and “0402” LED chip package bodies on the market.

2. The packaging method of the LED chip package body is made without awire bonding process, so that the output and the quality of the LED chippackage body are improved.

Referring to FIG. 5, the second embodiment of the present inventionprovides a light-transparent element 17 with side portion ground to forma planar side portion by a grinding process.

Referring to FIG. 6, the third embodiment of the present inventionfurther comprises a second light-transparent element 18 disposed on thefirst light-transparent element 17. Both the first and the secondlight-transparent element 17, 18 have a light-polarizing compound withdifferent wavelengths doped therein to provide light passing through thefirst and second light-transparent element 17, 18 with a good mixingcolor.

Referring to FIGS. 7 to 9, the fourth embodiment of the presentinvention provides an LED chip package and a packaging method of the LEDchip package.

Referring to FIG. 7, the steps of the fourth embodiment provide alight-emitting diode (LED) chip 10 having a pad-installed surface 100, aplurality of pads 102 disposed on the pad-installed surface 100 and arear surface 101 disposed opposite the pad-installed surface 100.

The steps of the fourth embodiment further provide a light-reflectingcoating 11 formed on the rear surface 101 of the LED chip 10, forming aninsulative protective layer 19 on the light-reflecting coating 11, andforming an insulative layer 20 on the pad-installed surface 100 of LEDchip 10. Both the insulative protective layer 19 and the insulativelayer 20 are made of a photoresist material like a sensitizationprinting ink.

Referring to FIG. 8, after the insulative layer 20 is formed on thepad-installed surface 100, a central through hole 200 is formed in theinsulative layer 20 for exposure of a central portion of thepad-installed surface 100 and a plurality of protrusions 12 is disposedon the corresponding pads 102 by a development and exposure process.

Referring to FIG. 9, the steps of the fourth embodiment further compriseforming a first metal layer 14 on each of the pads 102 for covering asurface of the corresponding pad 102 and the corresponding protrusion12. The first metal layer 14 is made of any metal material likealuminum.

Then, the steps of the fourth embodiment further comprise forming asecond metal layer 15 on the first metal layer 14. Each protrusion 12and the corresponding first and second metal layers 14, 15 are formedtogether to form a conductive projecting block. Each of the second metallayers 15 is composed of a nickel layer 150 and a gold layer 151.

Finally, a light-transparent element 17 is received in the centralthrough hole 200 of the insulative layer 20. The light-transparentelement 17 is made of any material or polyimide.

Referring to FIGS. 12 to 18, the fifth embodiment of the presentinvention provides an LED chip package and a packaging method of the LEDchip package.

Referring to FIGS. 12 and 13, the steps of the fifth embodiment provideat least one light-emitting diode chip 10 having a pad-installed surface100, a plurality of pads 102 disposed on the pad-installed surface 100and a rear surface 101 disposed opposite the pad-installed surface 100.

The steps of the fifth embodiment further comprise forming alight-reflecting coating 11 on the pad-installed surface 100. Thelight-reflecting coating 11 has a plurality of pad-exposed holes 110 forexposure of the corresponding pads 102.

The steps of the fifth embodiment further comprise forming a pluralityof protrusions 12 on the corresponding pads 102, after forming thelight-reflecting coating 11 on the pad-installed surface 100. Theprotrusions 12 are made of a photoresist like polyimide. First,photoresist material is used to form a protrusion layer (not shown indrawing) on the light-reflecting coating 11, then the protrusion layeris developed and exposed to form the protrusions 12.

The steps of the fifth embodiment further comprise forming a first metallayer 14 on each of the pads 102 for covering a surface of thecorresponding pad 102 and the corresponding protrusion 12. The firstmetal layer 14 is made of any metal material like aluminum.

The steps of the fifth embodiment further comprise forming a secondmetal layer 15 on the first metal layer 14. Each of the protrusions 12and the corresponding first and second metal layers 14, 15 are formedtogether to form a conductive projecting block. Each of the second metallayers 15 is composed of a nickel layer 150 and a gold layer 151.

Referring to FIGS. 14 and 15, the steps of the fifth embodiment providean insulative substrate 21. The insulative substrate 21 has a pluralityof chip-installed scopes 210. Each of the chip-installed scopes 210 hasa chip-installed surface 211, a rear face 212 formed opposite thechip-installed surface 211, a through hole 213 penetrating through thechip-installed surface 211 and the rear face 212, and a plurality ofconductive tracks 214 extending from the chip-installed surface 211 tothe rear face 212 through the through hole 213. The number of thethrough holes 213 is the same as that of the corresponding pads 102 ofthe LED chip 10.

The insulative substrate 21 is made of ceramic substrate or anyinsulative substrate like glass substrate.

Referring to FIG. 16, the steps of the fifth embodiment further compriseforming a substrate insulative layer 22 on the chip-installed surface211 of the insulative substrate 21. The substrate insulative layer 22 ismade of a photoresist material and has a plurality of open holes 220 forexposure of a central area of the corresponding chip-installed scopes210 by a development and exposure process. Then, the steps of the fifthembodiment further comprise forming a light-reflecting coating 23 on aninternal wall of each of the open holes 220.

Referring to FIG. 17, the LED chip 10 is received in the chip-installedscope 210. Each of the conductive projecting blocks is disposed on thecorresponding pads 102 and electrically connected to the correspondingconductive tracks 214 by a conductive body 24.

Referring to FIG. 18, the steps of the fifth embodiment further compriseforming a heat-conducting layer 26 between the insulative substrate 21and the at least one LED chip 10, and two opposite conductive bodies 24by a heat-conducting material through the through holes 213. Theheat-conducting material is a metal-insulator and heat-conductivematerial or a non-metal-insulator and heat-conductive material.

Then, a light-transparent element 25 is disposed on each of the LED chip10. The light-transparent element 25 is made of any material orpolyimide. The light-transparent element 25 has light-polarizingcompound with different wavelengths doped therein to provide lightpassing through the light-transparent element 25 with good color.

Finally, the insulative substrate 21 is cut to form a plurality of LEDchip package bodies. For example, each of the LED chip package bodieshas a chip-installed scope 210 or nine chip-installed scope 210 disposedin a matrix.

Referring to FIGS. 19 to 21, the sixth embodiment of the presentinvention provides an LED chip package and a packaging method of the LEDchip package.

Referring to FIG. 19, the steps of the sixth embodiment provide aninsulative substrate 21 with a chip-installed scope 210. Thechip-installed scope 210 has a area larger than that of thechip-installed scope 210 of the fifth embodiment.

Referring to FIG. 20, the steps of the sixth embodiment provide an LEDchip 10 and an insulative substrate 21. The insulative substrate 21 hasa plurality of chip-installed scopes 210. Each of the chip-installedscopes 210 has a chip-installed surface 211, a rear face 212 formedopposite the chip-installed surface 211, a through hole 213 penetratingthrough the chip-installed surface 211 and the rear face 212, and aplurality of conductive tracks 214 extending from the chip-installedsurface 211 to the rear face 212 through the through hole 213. Thenumber of the through holes 213 is the same as that of the correspondingpads 102 of the LED chip 10.

The steps of the sixth embodiment further comprise forming a substrateinsulative layer 22 on the chip-installed surface 211 of the insulativesubstrate 21.

Referring to FIG. 21, the LED chip 10 is received in the chip-installedscope 210. Each of the conductive projecting blocks is disposed on thecorresponding pads 102 and electrically connected to the correspondingconductive tracks 214 by a conductive body 24.

The steps of the sixth embodiment further comprise forming aheat-conducting layer 26 between the insulative substrate 21 and the atleast one LED chip 10, and two opposite conductive bodies 24 by aheat-conducting material through the through holes 213. Theheat-conducting material is a metal-insulator and heat-conductivematerial or a non-metal-insulator and heat-conductive material.

After forming the heat-conducting layer 26, the steps of the sixthembodiment further comprise forming an insulative material layer 29between the internal wall of each of the open holes 220 and thecorresponding conductive body 24. The insulative material layer 29 isthinner near the LED chip 10 and thicker near the substrate insulativelayer 22, so that the insulative material layer 29 has a concave topface.

The steps of the sixth embodiment further comprise forming a metalreflecting layer 30 formed on the insulative material layer 29 and atransparent protection layer 31 on the metal reflecting layer 30. Themetal reflecting layer 30 is used as a reflective mirror to reflectlight from the LED chip 10. Finally, the insulative substrate 21 is cutto form a plurality of LED chip package bodies.

FIGS. 22 to 27 shows the steps of another conductive projecting block.Referring to FIG. 22, the steps of the conductive projecting blockprovide a conductive contact point 32 (like a conductive metal ball)arranged on each of the pads 102 of the LED chip 10. The conductivecontact point 32 is a gold ball and can be made of any metal materials.

Referring to FIG. 23, the steps of another conductive projecting blockfurther comprise forming a first insulative layer 33 on thepad-installed surface 100 of the LED chip 10. The first insulative layer33 is made of a sensitization material and has a plurality of open holes330 for exposure of the corresponding conductive contact points 32.

Referring to FIGS. 24 and 25, the steps of another conductive projectingblock further comprise forming a second insulative layer 34 on the firstinsulative housing 33. The second insulative layer 34 has a plurality ofthrough holes 340 communicating with the corresponding open holes 330.The through hole 340 has a diameter larger than that of the open hole330. Then, the steps of the conductive projecting block further comprisefilling the open hole 330 and the through hole 340 with tin solder andforming a conductive welded point 35 to connect electrically to thecorresponding conductive contact point 32 by a reflow process. Theconductive welded point 35 has a side portion projecting out of thethrough hole 340.

Referring to FIG. 26, the side portion of the conductive welded point 35is projecting out of the through hole 340 and is ground to form a planarside portion by a grinding process.

Referring to FIG. 27, the steps of another conductive projecting blockfinally comprise eliminating the second insulative layer 34 from thefirst insulative layer 33. Thus, each of the conductive welded points 35and the corresponding conductive contact point 32 are joined to eachother to form the conductive projecting block.

FIGS. 28 to 32 show the steps of another conductive projecting block.Referring to FIG. 28, the steps of the conductive projecting blockprovide a conductive contact point 32 (like a conductive metal ball)arranged on each of the pads 102 of the LED chip 10. The conductivecontact point 32 is a gold ball and can be made of any metal materials.

Then, the steps of another conductive projecting block further compriseforming a first insulative layer 33 on the pad-installed surface 100 ofthe LED chip 10. The first insulative layer 33 is made of asensitization material and has a plurality of open holes 330 forexposure of the corresponding conductive contact points 32.

Referring to FIGS. 29 and 30, the steps of another conductive projectingblock further comprise forming a second insulative layer 34 on the firstinsulative housing 33. The second insulative layer 34 has a plurality ofthrough holes 340 communicating with the corresponding open holes 330.The through hole 340 has a diameter larger than that of the open hole330. Then, the steps of the conductive projecting block further comprisefilling the open hole 330 and the through hole 340 with tin solder andforming a conductive welded point 35 to connect electrically to thecorresponding conductive contact point 32 by a reflow process. Theconductive welded point 35 has a side portion projecting out of thethrough hole 340.

Referring to FIG. 31, the side portion of the conductive welded point 35is projecting out of the through hole 340 and is ground to form a planarside portion by a grinding process.

Referring to FIG. 32, the steps of another conductive projecting blockfinally comprise eliminating the second insulative layer 34 from thefirst insulative layer 33. Thus, each of the conductive welded points 35and the corresponding conductive contact point 32 are joined to eachother to form the conductive projecting block.

Referring to FIGS. 33 to 34, the seventh embodiment of the presentinvention provides an LED chip package and a packaging method of the LEDchip package. First, the steps of the seventh embodiment provide an LEDchip 10 according to the FIGS. 12 to 13 and a hollow light-transparentelement 36 made of glass material according to FIG. 33. Thelight-transparent element 36 has an inert gas like xenon or a liquid dyeor a fluorescent compound like light-polarizing compound injected intoan internal portion thereof. The steps of the seventh embodiment furthercomprise setting a total-reflection metal layer 37 on between the rearface of the LED chip 10 and a bottom face of the light-transparentelement 36 and a half-reflection metal layer 38 on a top face of thelight-transparent element 36.

Referring to FIG. 34, the steps of the seventh embodiment comprisesetting a transparent viscous material (not shown in drawing) betweenthe rear face 101 of the LED chip 10 and the total-reflection metallayer 37. The light-transparent element 36 is disposed on thetransparent viscous material. The light-transparent element 36 is madeof any transparent insulative material such as, for example, transparentepoxy resin, polyidmide or polyvinyl chloride When the light-transparentelement 36 is made of transparent insulating material, the transparentinsulating material is doped with a light-polarizing compound.

Although the present invention has been described with reference to thepreferred embodiment thereof, it will be understood that the inventionis not limited to the details thereof. Various substitutions andmodification have suggested in the foregoing description, and other willoccur to those of ordinary skill in the art. Therefore, all suchsubstitutions and modifications are intended to be embraced within thescope of the invention as defined in the appended claims.

1. A packaging method of a light-emitting diode chip package body, thepackaging method, comprising: providing a light-emitting diode chiphaving a pad-installed surface formed thereon, a plurality of padsinstalled on the pad-installed surface and a rear surface formed on anopposite side of the pad-installed surface; setting a light-reflectingcoating on the pad-installed surface, the light-reflecting coatinghaving a plurality of pad-exposed holes for exposure of thecorresponding pads of the light-emitting diode; forming a surfaceinsulation layer on the rear surface of the light-emitting diode chip,the surface insulation layer having a central through hole for exposureof a central portion of the rear surface; setting a firstlight-transparent element in the central through hole of the surfaceinsulation layer; and setting a plurality of conductive projectingblocks, each of the conductive projecting blocks being disposed on thecorresponding pad of the light-emitting diode.
 2. The packaging methodas claimed in claim 1, wherein the setting of the firstlight-transparent element has a cambered top portion.
 3. The packagebody as claimed in claim 1, wherein the setting of the firstlight-transparent element has a planar top portion.
 4. The packagingmethod as claimed in claim 1, further comprising setting a secondlight-transparent element on the top portion of the firstlight-transparent element, both the first and the secondlight-transparent element being doped with light-polarizing compoundswith different wavelengths.
 5. The packaging method as claimed in claim1, wherein the setting of each of the conductive projecting blockscomprises: forming a protrusion made of a nonconductive material and onthe corresponding pad of the light-emitting diode chip; forming a firstmetal layer on the corresponding pad of the light-emitting diode chipfor covering a corresponding surface of the pad and the protrusion ofthe corresponding pad; and forming a second metal layer on thecorresponding first metal layer.
 6. The packaging method as claimed inclaim 5, wherein the setting of each of the second metal layers iscomposed of a nickel layer and a gold layer.
 7. The packaging method asclaimed in claim 1, further comprising forming a bonded metal layer onthe corresponding pad.
 8. The packaging method as claimed in claim 7,wherein the setting of each of the conductive projecting blockscomprises: forming a protrusion made of a nonconductive material and onthe corresponding bonded metal layer of the light-emitting diode chip;forming a first metal layer on the corresponding bonded metal layer ofthe light-emitting diode chip for covering a corresponding surface ofthe bonded metal layer and the protrusion of the corresponding bondedmetal layer; and forming a second metal layer on the corresponding firstmetal layer.
 9. The packaging method as claimed in claim 8, wherein thesetting of each of the second metal layers is composed of a nickel layerand a gold layer.
 10. The packaging method as claimed in claim 1,wherein the setting of each of the conductive projecting blocks is madeof gold.
 11. The packaging method as claimed in claim 1, wherein thesetting of each of the conductive projecting blocks comprises: setting aconductive contact point on the corresponding pad of the light-emittingdiode chip; forming a first insulative layer on the light-reflectingcoating, the first insulative layer having a plurality of open holes forexposure of at least one part of the corresponding conductive contactpoint; forming a second insulative layer on the first insulativehousing, the second insulative layer having a plurality of through holescommunicating with the corresponding open holes, and the through holehaving a diameter larger than that of the open hole; filling the openhole and the through hole with tin solder; forming a conductive weldedpoint to connect electrically to the corresponding conductive contactpoint by a reflow process, the conductive welded point having a sideportion projecting out of the through hole; grinding the side portion toform a planar side portion by a grinding process; and eliminating thesecond insulative layer from the first insulative layer.
 12. A packagingmethod of a light-emitting diode chip package body, the packaging methodcomprising: providing a light-emitting diode chip having a pad-installedsurface formed thereon, a plurality of pads installed on thepad-installed surface and a rear surface formed on an opposite side ofthe pad-installed surface; setting a light-reflecting coating on therear surface of the light-emitting diode chip; forming an insulativeprotective layer on the light-reflecting coating; forming an insulativelayer on the pad-installed surface of the light-emitting diode chip, theinsulative layer having a central through hole for exposure of a centralportion of the pad-installed surface and plurality of pad-exposed holesfor exposure of the corresponding pads; setting a firstlight-transparent element in the central through hole of the insulationlayer; and setting a plurality of conductive projecting blocks, each ofthe conductive projecting blocks disposed on the corresponding pad ofthe light-emitting diode.
 13. The package body as claimed in claim 12,wherein the setting of the first light-transparent element has a planartop portion.
 14. The packaging method as claimed in claim 13, furthercomprising setting a second light-transparent element on the top portionof the first light-transparent element, both the first and the secondlight-transparent element being doped with light-polarizing compoundswith different wavelengths.
 15. The packaging method as claimed in claim12, wherein the setting of each of the conductive projecting blockscomprises: forming a protrusion made of a nonconductive material and onthe corresponding pad of the light-emitting diode chip; forming a firstmetal layer on the corresponding pad of the light-emitting diode chipfor covering a corresponding surface of the pad and the protrusion ofthe corresponding pad; and forming a second metal layer on thecorresponding first metal layer.
 16. The packaging method as claimed inclaim 15, wherein the setting of each of the second metal layers iscomposed of a nickel layer and a gold layer.
 17. The packaging method asclaimed in claim 12, further comprising forming a bonded metal layer onthe corresponding pad.
 18. The packaging method as claimed in claim 17,wherein the setting of each of the conductive projecting blockscomprises: forming a protrusion made of a nonconductive material and onthe corresponding bonded metal layer of the light-emitting diode chip;forming a first metal layer on the corresponding bonded metal layer ofthe light-emitting diode chip for covering a corresponding surface ofthe bonded metal layer and the protrusion of the corresponding bondedmetal layer; and forming a second metal layer on the corresponding firstmetal layer.
 19. The packaging method as claimed in claim 18, whereinthe setting of each of the second metal layers is composed of a nickellayer and a gold layer.
 20. The packaging method as claimed in claim 12,wherein the setting of each of the conductive projecting blocks is madeof gold.
 21. A packaging method of a light-emitting diode chip packagebody, the packaging method, comprising: providing an insulativesubstrate including at least one chip-installed scope, the at least onechip-installed scope having a chip-installed surface, a rear face formedopposite the chip-installed surface, a through hole penetrating throughthe chip-installed surface and the rear face and a plurality ofconductive tracks extending from the chip-installed surface to the rearface through the through hole; setting a substrate insulative layer onthe chip-installed surface to form an open hole for exposure of acentral scope of the at least one chip-installed scope; setting at leastone light-emitting diode chip on the at least one chip-installed scopeof the insulative substrate, the at least one light-emitting diode chiphaving a pad-installed surface formed thereon, a plurality of padsinstalled on the pad-installed surface and a rear surface formed on anopposite side of the pad-installed surface; setting a light-reflectingcoating on the pad-installed surface, the light-reflecting coatinghaving a plurality of pad-exposed holes for exposure of thecorresponding pads of the at least one light-emitting diode chip;setting a plurality of conductive projecting blocks, each of theconductive projecting blocks disposed on the corresponding pad of the atleast one light-emitting diode chip and electrically connected to thecorresponding conductive tracks; forming a heat-conducting layer betweenthe insulative substrate and the at least one light-emitting diode chip;and setting a light-transparent element on the rear face of the at leastone light-emitting diode chip.
 22. The packaging method as claimed inclaim 21, further comprising forming a light-reflecting coating on aninternal wall of the open hole.
 23. The packaging method as claimed inclaim 21, further comprising setting a plurality of conductive bodies,the conductive projecting blocks being electrically connected to thecorresponding conductive tracks by the corresponding conductive bodies.24. The packaging method as claimed in claim 21, wherein theheat-conducting layer is made of metal-insulator material andheat-conductive material.
 25. The packaging method as claimed in claim21, wherein the heat-conducting layer is made of non-metal-insulatormaterial and heat-conductive material.
 26. The packaging method asclaimed in claim 21, wherein the light-transparent element has dyepowder doped therein.
 27. The packaging method as claimed in claim 21,wherein the setting of each of the conductive projecting blockscomprises: setting a protrusion made of a nonconductive material and onthe corresponding pad of the light-emitting diode chip; forming a firstmetal layer on the corresponding pad of the light-emitting diode chipfor covering a corresponding surface of the pad and the protrusion ofthe corresponding pad; and forming a second metal layer on thecorresponding first metal layer.
 28. The packaging method as claimed inclaim 27, wherein the forming of each of the second metal layers iscomposed of a nickel layer and a gold layer.
 29. The packaging method asclaimed in claim 21, further comprising forming a bonded metal layer onthe corresponding pad.
 30. The packaging method as claimed in claim 29,wherein the setting of each of the conductive projecting blockscomprises: setting a protrusion made of a nonconductive material and onthe corresponding bonded metal layer; forming a first metal layer on thecorresponding bonded metal layer for covering a corresponding surface ofthe bonded metal layer and the protrusion of the corresponding bondedmetal layer; and forming a second metal layer on the corresponding firstmetal layer.
 31. The packaging method as claimed in claim 30, whereineach of the second metal layers is composed of a nickel layer and a goldlayer.
 32. The packaging method as claimed in claim 21, wherein thesetting of each of the conductive projecting blocks is made of gold. 33.The packaging method as claimed in claim 21, wherein the setting of eachof the conductive projecting blocks comprises: setting a conductivecontact point on the corresponding pad of the light-emitting diode chip;forming a first insulative layer on the light-reflecting coating, thefirst insulative layer having a plurality of open holes for exposure ofat least one part of the corresponding conductive contact point; forminga second insulative layer on the first insulative housing, the secondinsulative layer having a plurality of through holes communicating withthe corresponding open holes, and the through hole having a diameterlarger than that of the open hole; filling the open hole and the throughhole with tin solder; forming a conductive welded point to connectelectrically to the corresponding conductive contact point by a reflowprocess, and the conductive welded point having a side portionprojecting out of the through hole; grinding the side portion to form aplanar side portion by a grinding process; and eliminating the secondinsulative layer from the first insulative layer.
 34. A packaging methodof a light-emitting diode chip package body, the packaging methodcomprising: providing an insulative substrate including at least onechip-installed scope, the at least one chip-installed scope having achip-installed surface, a rear face formed opposite the chip-installedsurface, a through hole penetrating through the chip-installed surfaceand the rear face and a plurality of conductive tracks extending fromthe chip-installed surface to the rear face through the through hole;setting a substrate insulative layer on the chip-installed surface toform an open hole for exposure of a central scope of the at least onechip-installed scope; setting at least one light-emitting diode chip onthe at least one chip-installed scope of the insulative substrate, theat least one light-emitting diode chip having a pad-installed surfaceformed thereon, a plurality of pads installed on the pad-installedsurface and a rear surface formed on an opposite side of thepad-installed surface; forming a heat-conducting layer between theinsulative substrate and the at least one light-emitting diode chip;setting an insulative material layer between the internal wall of eachof the open holes and the corresponding conductive body, the insulativematerial layer being thicker near the at least one light-emitting diodechip and thinner near the substrate insulative layer, so that theinsulative material layer has a concave top face; forming a metalreflecting layer on the insulative layer; forming a transparentprotection layer on the metal reflecting layer; and setting a pluralityof conductive projecting blocks, each of the conductive projectingblocks disposed on the corresponding pad of the at least onelight-emitting diode chip and electrically connected to thecorresponding conductive tracks.
 35. The packaging method as claimed inclaim 34, further comprising setting a plurality of conductive bodies,and the conductive projecting blocks electrically connected to thecorresponding conductive tracks by the corresponding conductive bodies.36. The packaging method as claimed in claim 34, wherein theheat-conducting layer is made of metal-insulator material andheat-conductive material.
 37. The packaging method as claimed in claim34, wherein the heat-conducting layer is made of non-metal-insulatormaterial and heat-conductive material.
 38. The packaging method asclaimed in claim 34, wherein the setting of each of the conductiveprojecting blocks comprises: setting a protrusion made of anonconductive material and on the corresponding pad of thelight-emitting diode chip; forming a first metal layer on thecorresponding pad of the light-emitting diode chip for covering acorresponding surface of the pad and the protrusion of the correspondingpad; and forming a second metal layer on the corresponding first metallayer.
 39. The packaging method as claimed in claim 38, wherein each ofthe second metal layers is composed of a nickel layer and a gold layer.40. The packaging method as claimed in claim 34, further comprisingforming a bonded metal layer on the corresponding pad.
 41. The packagingmethod as claimed in claim 40, wherein the setting of each of theconductive projecting blocks comprises: setting a protrusion made of anonconductive material and on the corresponding bonded metal layer;forming a first metal layer on the corresponding bonded metal layer forcovering a corresponding surface of the bonded metal layer and theprotrusion of the corresponding bonded metal layer; and forming a secondmetal layer on the corresponding first metal layer.
 42. The packagingmethod as claimed in claim 41, wherein each of the second metal layersis composed of a nickel layer and a gold layer.
 43. The packaging methodas claimed in claim 34, wherein the setting of each of conductiveprojecting blocks is made of gold.
 44. The packaging method as claimedin claim 34, wherein the setting of each of the conductive projectingblocks comprises: setting a conductive contact point on thecorresponding pad of the light-emitting diode chip; forming a firstinsulative layer on the light-reflecting coating, the first insulativelayer having a plurality of open holes for exposure of at least one partof the corresponding conductive contact point; forming a secondinsulative layer on the first insulative housing, the second insulativelayer having a plurality of through holes communicating with thecorresponding open holes, and the through hole having a diameter largerthan that of the open hole; filling the open hole and the through holewith tin solder; forming a conductive welded point to connectelectrically to the corresponding conductive contact point by a reflowprocess, and the conductive welded point having a side portionprojecting out of the through hole; grinding the side portion to form aplanar side portion by a grinding process; and eliminating the secondinsulative layer from the first insulative layer.
 45. A packaging methodof a light-emitting diode chip package body, the packaging methodcomprising: providing a light-emitting diode chip having a pad-installedsurface formed thereon, a plurality of pads installed on thepad-installed surface and a rear surface formed on an opposite side ofthe pad-installed surface; setting a light-reflecting coating on thepad-installed surface, the light-reflecting coating having a pluralityof pad-exposed holes for exposure of the corresponding pads of thelight-emitting diode; setting a first light-transparent element on therear face of the light-emitting diode chip; and setting a plurality ofconductive projecting blocks, each of the conductive projecting blocksbeing disposed on the corresponding pad of the light-emitting diode. 46.The packaging method as claimed in claim 45, further comprising forminga total-reflection metal layer between the rear face of thelight-emitting diode chip and a bottom face of the light-transparentelement.
 47. The packaging method as claimed in claim 45, furthercomprising forming a half-reflection metal layer on a top face of thelight-transparent element.
 48. The packaging method as claimed in claim45, wherein the setting of the light-transparent element is made ofglass material to form a hollow light-transparent element and has inertgas injected into an internal portion thereof.
 49. The packaging methodas claimed in claim 45, wherein the setting of the light-transparentelement is made of glass material to form a hollow light-transparentelement and has liquid dye or fluorescent compound injected into aninternal portion thereof.
 50. The packaging method as claimed in claim45, wherein the setting of the light-transparent element is made oftransparent insulating material, and the transparent insulating materialhas light-polarizing compound doped therein.
 51. The packaging method asclaimed in claim 45, wherein the setting of each of the conductiveprojecting blocks comprises: setting a protrusion made of anonconductive material and on the corresponding bonded metal layer;forming a first metal layer on the corresponding bonded metal layer forcovering a corresponding surface of the bonded metal layer and theprotrusion of the corresponding bonded metal layer; and forming a secondmetal layer on the corresponding first metal layer.
 52. The packagingmethod as claimed in claim 51, wherein each of the second metal layersis composed of a nickel layer and a gold layer.
 53. The packaging methodas claimed in claim 45, further comprising forming a bonded metal layeron the corresponding pad.
 54. The packaging method as claimed in claim53, wherein the setting of each of the conductive projecting blockscomprises: setting a protrusion made of a nonconductive material and onthe corresponding bonded metal layer; forming a first metal layer on thecorresponding bonded metal layer for covering a corresponding surface ofthe bonded metal layer and the protrusion of the corresponding bondedmetal layer; and forming a second metal layer on the corresponding firstmetal layer.
 55. The packaging method as claimed in claim 54, whereineach of the second metal layers is composed of a nickel layer and a goldlayer.
 56. The packaging method as claimed in claim 45, wherein thesetting of each of the conductive projecting blocks is made of gold. 57.The packaging method as claimed in claim 45, wherein the setting of eachof the conductive projecting blocks comprises: setting a conductivecontact point on the corresponding pad of the light-emitting diode chip;forming a first insulative layer on the light-reflecting coating, thefirst insulative layer having a plurality of open holes for exposure ofat least one part of the corresponding conductive contact point; forminga second insulative layer on the first insulative housing, the secondinsulative layer having a plurality of through holes communicating withthe corresponding open holes, and the through hole having a diameterlarger than that of the open hole; filling the open hole and the throughhole with tin solder; forming a conductive welded point to connectelectrically to the corresponding conductive contact point by a reflowprocess, the conductive welded point having a side portion projectingout of the through hole; grinding the side portion to form a planar sideportion by a grinding process; and eliminating the second insulativelayer from the first insulative layer.